EVG6200NT /200/TB mask aligner by EVGroup (EVG) for contact and proximity exposure.

Technical specification

• Substrate size from pieces, up to 200mm (round)
• Photomask size from 2,5”x2,5” to 9”x9”, thickness <7mm
• Top Side Alignment (TSA) and Back Side Alignment (BSA)
• Exposure in spectral lines at 436 nm (“g-line”), 405 nm (“h-line”) and 365 nm (“i-line”)
• Exposure modes: proximity, soft contact, hard contact, vacuum contact
• Wafer alignment for wafer bonding process

Application

• Fabrication pattern in resist through photomask
• Wafer alignment for wafer bonding process