Two stacks of horizontal furnaces by Termco System enables repeatable high-temperature processes for micro- nano- electronics, photonics and photovoltaics applications.
Technical Specifications
- Two furnaces has 3 independent tubes for high temperature processes
- The processes chamber allows loading up to 50 silicon wafers in diameter of 100mm and 150mm, and up to 25 silicon wafers in diameter of 200mm
Application
- High temperature annealing up to 1200°C
- Wet and Dry oxidation
- Ultra-Thin silicon oxidation
- Boron diffusion
- Low-pressure chemical vapor deposition ramped Poly Si (a-Si) and silicon nitride (Si3N4)
